Experimental Investigations of Enhanced Micro Structured Heat Sinks
الباحث الأول:
Ammar M. Hadi
الباحثين الآخرين:
, Muneer A. Ismael
, Maher A.R. Sadiq
, Haider A. Alhattab
المجلة:
Journal of Physics: Conference Series/MAICT-IOP Publishing
تاريخ النشر:
None
مختصر البحث:
In this research, we focus on the performance of heat sink, new configurations of the
micro heat sink with comprises of pinned copper pieces of appropriate dimensions have been
proposed. Dozens of different shapes micro heat sinks have been manu…
In this research, we focus on the performance of heat sink, new configurations of the
micro heat sink with comprises of pinned copper pieces of appropriate dimensions have been
proposed. Dozens of different shapes micro heat sinks have been manufactured from brass using
Laser technique. These heat sinks have been coupled individually with a simulated electronic
circuit including a power transistor to freely dissipate the generated heat. Bulk temperatures of
heat sink and the power transistor have been measured using a thermal camera. The results
showed that, in general, the finned heat sink of either configuration augments heat transfer
compared with smooth one. It is found that the maximum percentage reductions in temperature
of the transistor are demonstrated with two uncommon configurations, namely the leaves-shaped
fin (LSF) 9.352% and the drop-shaped fin (DSF) 9.353%. on the other hand, a staggered wavy
fin (SWF) shows minimum percentage reduction in transistor temperature, 0.952%. It has been
shown that through this research and by using several models of heat sink, the increase in surface
area is not only the factor (major) to increase the heat transfer to the surrounding environment.
This makes it possible to design fins with a smaller surface area but more heat dispersion.
